We hope to see you at the 2022 conference for UV/EB curing technology
The three day, in-person show is the world's largest UV/EB curing event. Join us to address the future of radiation curing, examine new and emerging trends and innovations, and take a close look at new applications. Our experts will present on the latest research, current developments and innovations in the field of UV/EB curing. Our team will be on-site and ready to meet with you at our booth too!
An exciting lineup of technical presentations
Tuesday, May 10
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Dielectric performance of UV-Curable piezo-inkjet resins for dielectric coating applications, Dr. Donald Herr, 1A: Structural & Flexible Electronics, 8:00am
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XKm formulation strategies for TPO replacement, Jonathan Andersson, 1B: Cationic/Photoinitiator, 8:00am
Wednesday, May 11
- Strategies towards sustainable UV solutions with reduced hazard and reduced migration potential, Dr. Richard Plenderleith, 4A: Next Level Formulations, 8:00am
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Structured urethane acrylates vs. telechelic urethane acrylates comparison in inkjet applications, Dr. Endrit Shurdha, 5C: Optimized Materials, 11:00am
Thursday, May 12
- High temperature additive manufacturing materials, Dr. Neil Cramer, 7A: Additive Manufacturing, 8:00am
- Structured urethane acrylates in LVT applications, Elaine Ruiz, 7B: Building Materials, 8:00am
Discover some of our latest innovations
Resins
- Structured Urethane Acrylates (SUA), acrylated urethane oligomers that expand the properties which can be obtained in cured materials vs. traditional UA resins
- Dielectric resins for high frequency applications
- Resins to enhance dielectric conformal coatings
- SARBIO® biobased resins with USDA certification
- UVICURE cationic resins, including epoxy, oxetane diluent and oxetane property modifiers
Photoinitiators
- SPEEDCURE photoinitiators, a full range of single-component and specialist-formulated photoinitiator products for UV free radical and cationic curing
- SPEEDCURE LTX, LED-curable liquid thioxanthone photoinitiator that is easier to add to formulations and provides better solubility than traditional solid photoinitiators
- SPEEDCURE XKm, hybrid PI for specialty inks and coatings with friendly labelling
3D Printing
- Custom formulations and materials development
- High temperature materials and heat resistance
- Ultra low loss dielectric resins for high frequency applications
- When ?
May 9th to May 12th
- Where ?
Hyatt Regency Orlando
Orlando, FL
United States- Booth ?
501
- Access ?